3M™ Boron Nitride Cooling Fillers for ePowertrain are the solution for the ongoing miniaturization and large-scale production (LED/ automotive) of electronic components requires materials that can quickly and effectively dissipate heat within an extremely small space. Highly thermally conductive polymers are used for applications involving the transfer, propagation or dissipation of thermal energy. Modern thermal management composites offer extremely good thermal conductivity while retaining the typical properties of plastics such as electrical insulation and low weight.
Fields of Application
Consumer Electronics: Dissipating Heat
In the consumer electronics sector, 3M™ Boron Nitride Cooling Fillers aid in heat dissipation in mobile devices and televisions. As these devices get thinner, heat dissipation and electrical isolation are more crucial than ever. 3M™ Boron Nitride can be easily compounded with thermoplastics for injection molding or extrusion of pads, LED housings and heat sinks. One specific focus is in TIM applications – epoxy, silicon and acrylates – due to their thermal conductivity and electrical insulation capabilities, in addition to having a range of particle distributions and top cut sizes.
Automotive: Thermal Management for Batteries and Housings
When used in thermoplastics and elastomers, 3M™ Boron Nitride Cooling Fillers are useful in automotive applications such as batteries and housings for electric and hybrid vehicles, as well as LEDs. When combined with thermosets, they can be directly injection molded or used in potting resins around electronic components to isolate them from moisture and dissipate heat.
Motors and Generators: Electrical Insulation and Thermal Conductivity
3M™ Boron Nitride Cooling Fillers are used increasingly in applications where the highest electrical insulation is required to also achieve a high thermal conductivity. They are commonly added to polyester, polyimide and PEEK, where they are useful in high-temperature insulation foils. Our boron nitride cooling fillers are suitable for use with a variety of foil thickness, from 150 microns to 25 microns.
3M™ Boron Nitride Cooling Filler Platelets are powders of highly crystalline single platelets for thermal management applications with excellent heat spreading capabilities as an economical alternative to mineral and oxide based filled compounds.