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3M™ CMP Pad Conditioner Brush

  • Durable brush bristles assist with removal of pad debris from microreplicated, porometric and felt-based pads
  • Easy connection to polishing tool end effector
  • Exclusive polymer substrate enhances corrosion resistance
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Specifications
Abrasive Working Surface
Full Face
Applications
CMP
Brand
3M™
Bristle Diameter
0.005 in, 0.012 in
Brush Material-Density
Nylon, >1200/sq in, Nylon, >2000/sq in
Carrier Color
Black
Carrier Format
Disk
Carrier Material
410 Stainless Steel, Polycarbonate
Carrier Size
4.25 inch diameter
Carrier Substrate
Polycarbonate
CMP Process
Cu (barrier), Final Buff, W (buff)
Manufacturing Location
United States
Mineral Type
Nylon Fibers
Product Series
PB33A, PB52A
Product Type
Pad Conditioner Brush
Product Details
  • Durable brush bristles assist with removal of pad debris from microreplicated, porometric and felt-based pads
  • Easy connection to polishing tool end effector
  • Exclusive polymer substrate enhances corrosion resistance

Engineered CMP pad conditioner brushes are designed for critical semiconductor buff CMP applications.