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  • 3M™ Scotch-Weld™ Low Density Void Filler 3500-2 B/A
  • 3M™ Scotch-Weld™ Low Density Void Filler 3500-2 B/A

    3M ID 7000033767
    • Convenient 1:1 mix ratio by weight
    • Thixotropic for ease of application
    • May be mixed by hand or machine and applied by hand, trowel or extrusion machine
    • Room temperature storage of the two compounds
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    Specifications
    Brand
    Scotch-Weld™
    Product Details
    • Convenient 1:1 mix ratio by weight
    • Thixotropic for ease of application
    • May be mixed by hand or machine and applied by hand, trowel or extrusion machine
    • Room temperature storage of the two compounds
    • Excellent water and chemical resistance
    • Room temperature storage

    A high temperature curing low density void filler. Suitable for honeycomb sandwich void filling, splicing and reinforcing.

    High in service performance from -55oC to +175oC

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