Specifications
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Brand
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Scotch-Weld™
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Product Details
- Convenient 1:1 mix ratio by weight
- Thixotropic for ease of application
- May be mixed by hand or machine and applied by hand, trowel or extrusion machine
- Room temperature storage of the two compounds
- Excellent water and chemical resistance
- Room temperature storage
A high temperature curing low density void filler. Suitable for honeycomb sandwich void filling, splicing and reinforcing.
High in service performance from -55oC to +175oC
Documents
Safety Data Sheets
