3M™ Scotch-Weld™ Low Density Void Filler 3500-2 B/A

3M ID 7000033767

Convenient 1:1 mix ratio by weight
Thixotropic for ease of application
May be mixed by hand or machine and applied by hand, trowel or extrusion machine
Room temperature storage of the two compounds

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Specifications


Brand	Scotch-Weld™

Product Details

Convenient 1:1 mix ratio by weight
Thixotropic for ease of application
May be mixed by hand or machine and applied by hand, trowel or extrusion machine
Room temperature storage of the two compounds
Excellent water and chemical resistance
Room temperature storage

A high temperature curing low density void filler. Suitable for honeycomb sandwich void filling, splicing and reinforcing.

High in service performance from -55oC to +175oC

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