3M™ Scotch-Weld™ Structural Void Filling Compound 3584 B/A

• Cures to a strong low density material within 16 hours at ambient temperature above 21°C (70°F)
• Cures to a strong low density material within 16 hours at ambient temperatures above 21° C (70° F)
• Cures to a strong low density material within 16 hours at ambient temperatures above 21° C (70° F)
• Thixotropic properties for ease of application

3M™ Scotch-Weld™ void filling compound 3584 B/A is a two part room temperature curing epoxy based product with extremely low density.

One component is blue, the other yellow, so that complete mixing of components gives a light green product