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  • 3M™ Scotch-Weld™ Structural Void Filling Compound 3584 B/A
  • 3M™ Scotch-Weld™ Structural Void Filling Compound 3584 B/A

    3M ID 7000079984
    • Cures to a strong low density material within 16 hours at ambient temperature above 21°C (70°F)
    • Cures to a strong low density material within 16 hours at ambient temperatures above 21° C (70° F)
    • Cures to a strong low density material within 16 hours at ambient temperatures above 21° C (70° F)
    • Thixotropic properties for ease of application
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    Specifications
    Brand
    Scotch-Weld™
    Product Details
    • Cures to a strong low density material within 16 hours at ambient temperature above 21°C (70°F)
    • Cures to a strong low density material within 16 hours at ambient temperatures above 21° C (70° F)
    • Cures to a strong low density material within 16 hours at ambient temperatures above 21° C (70° F)
    • Thixotropic properties for ease of application

    3M™ Scotch-Weld™ void filling compound 3584 B/A is a two part room temperature curing epoxy based product with extremely low density.

    One component is blue, the other yellow, so that complete mixing of components gives a light green product