- Convenient 1:1 mix ratio by weight
- Thixotropic for ease of application
- May be mixed by hand or machine and applied by hand, trowel or extrusion machine
- Room temperature storage of the two compounds
- Excellent water and chemical resistance
- Cures from 120oC to 175oC in one hour
A high temperature curing low density void filler. Suitable for honeycomb sandwich void filling, splicing and reinforcing.
High in service performance from -55oC to +175oC