Photo of Semiconductor circuitry in the  semiconductor manufacturing process.
Maximize your semiconductor production process.

3M products for semiconductor manufacturing.


Semiconductor Filtration

Reducing contaminants is crucial in semiconductor manufacturing.  Any particles or metals not removed during production can lead to defects, or even product recalls, later. That’s why you need the proven performance of 3M filtration products for every step in your manufacturing process.

Integrated Circuit Fabrication Process. from incoming water to the UltraPure Water system

Applications for Semiconductor

For more than 100 years, 3M has developed innovative filtration and purification products by partnering with our customers to meet the ever-evolving needs of semiconductor manufacturing.

UltraPure Water

UltraPure water (UPW) is mainly used to remove defect-causing contaminants from the wafer surface and to rinse or clean wafers after they have been exposed to chemicals during various processes.

3M’s filtration and gas transfer membrane products provide the required particle reduction and dissolved gas (O₂ & CO₂) reduction to meet the strict requirements of semiconductor and electronics industry.

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Chemical Mechanical Polishing

Chemical mechanical polishing (CMP) is a process to level uneven areas by combining a chemical (acidic or basic) slurry of micro-abrasives with mechanical force provided by polishing. In multilevel metallization processes, as each new metal layer gets added it magnifies the imperfections in the layer just below it. CMP allows for subsequent photolithography processes to take place with greater accuracy.

3M has the filtration solutions to control particle size in the slurries used in the CMP process to allow chipmakers to continue shrinking circuity needed in next generation devices.

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Lithography/High Purity Chem

Photolithography is a process used to pattern circuitry on a wafer. Removing unwanted organic contaminants, particles and ionic metal species from high purity chemicals supports the advancement of miniaturization of devices.

Filtration and purification products from 3M allow you to reduce contaminants to meet the needs of high-performance semiconductor manufacturing.

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Electrolyte Plating

ElectroPlating solutions require both stringent particle and dissolved gas control to prevent defects and impurities in the deposited metal layer.

3M has both particle and and dissolved gas solutions to meet the needs for your electroplating process.

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Wet Cleaning Chemicals

During wet processing, semiconductor devices are repeatedly dipped, immersed, or sprayed with solutions Even when cleaning steps are performed, the primary reason for device failure is contamination of the wafer surface. As device features continue to shrink, ensuring the purity of acids, bases, and solvents used in the manufacture process will remain critical.

From most acids and bases to alcohols and etchants, 3M has the filter for your chemical application.

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Manufacturing semiconductors requires large amounts of chemicals, which invariably generates substantial volumes of wastewater. The many different fabrication processes create a variety of wastewater contaminants.

3M has filtration solutions designed to help you filter your wastewater to protect the environment and meet increasingly stringent discharge requirements.

3M™ Liqui-Cel™ Membrane Contactors are used in a variety of gas transfer applications to strip dissolved gases from aqueous fluids. In one specific use, ammonia gas is stripped from wastewater streams with a high concentration of ammonia, diffuses across the wall of a hollow fiber membrane, and is directly absorbed into a reactive acid solution.

This simultaneous removal and recovery of ammonia is possible in a single device. This process is called TMCS (Transmembrane Chemisorption).

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Dissolved Gas Control

3M™ Liqui-Cel™ Membrane Contactors provide efficient dissolved gas control in a compact design. Capable of adding gases to or removing dissolved gases and bubbles from compatible liquid streams, these gas transfer devices utilize hollow fiber membrane technology that help facilities around the world improve operating efficiency, performance and protect product quality.

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Key Resources

Find more information for reliable and cost-effective filtration solutions for your microelectronics manufacturing operation.
Technical / Application Briefs

Inlet Water & Sweep Gas Guidelines for 3M™ Liqui-Cel™ Membrane Contactors (Operating Guidelines)(PDF, 84.7 KB)

Ion Exchange: Using Membrane Contactors for CO₂ Removal to Extend Resin Bed Life (Article)(PDF, 137 KB)

Ultrapure Water: Systems for Microelectronics (Article)(PDF, 2.2 MB)

Microelectronics: Lessons Learned - The Installation of a 300 to 600 GPM Semiconductor High-Purity Water System (Article)(PDF, 47.6 KB)

Microelectronics: Membrane Processes for Water Treatment in the Semiconductor Industry (Article)(PDF, 88.7 KB)

Membranes: How to Meet Today's Dissolved Oxygen Specifications with Degasification Membranes (Article)(PDF, 93.7 KB)

Precise Control of Dissolved O2 and N2 in Semiconductor Applications Using 3M™ Liqui-Cel™ Membrane Contactors (Technical Brief)(PDF, 202 KB)

IMEC UPW System Utilizes 3M™ Liqui-Cel™ Membrane Contactors for Oxygen Removal (Technical Brief)(PDF, 160 KB)

3M™ Liqui-Cel™ Membrane Contactors Improve Water Quality and EDI Performance (Technical Brief)(PDF, 283 KB)

Chemical Mechanical Planarization - Slurry Distribution System (Customer Application Brief)(PDF, 3.5 MB)

Filtration in Process Cooling Water (Customer Application Brief)(PDF, 120 KB)

Next Generation Purification Method for Achieving Low Trace Metals in Ultra-high Purity Chemicals (Technical Brief)(PDF, 535 KB)

3M Immobilized Micro-Bed IonExchange Resin Bed Technology Treatment of PGMEA (Technical Brief)(PDF, 593 KB)

Next Generation Composite, Rigid Filter for Chemical Mechanical Planarization (Technical Brief)(PDF, 443 KB)

Impacts of Point-of-Use Filtration on an ILD CMP Process (Technical Brief)(PDF, 533 KB)

Data Sheets