3M™ Wafer De-Taping Tape 879
- 3M ID B5005035268
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Highlights
- Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
- Transparency allows for inspection without tape removal
- High instant adhesion to substrate
- Good holding power
3M™ Wafer De-Taping Tape 879 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ Wafer Support Systems (WSS) adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.
A transparent polyester film tape with an agressive rubber adhesive specifically designed for the removal of silicon wafer backgrinding tape.
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