3M™ Scotch-Weld™ Structural Adhesive Film AF 3109-2U .035wt, 48 in x 25 yd, 1 per case

• Cure temperatures as low as 225°F (107°C) and up to 350°F (177°C)
• Helps streamline production; range of curing temperature from 225°F (107°C) to 350°F (176°C)
• Helps streamline production; range of curing temperature from 225°F (107°C) to 350°F (176°C)
• Adhesive can be cured from 225°F (107°C) up to 350°F (175°C)
• Epoxy designed for bonding composites, metal-to-metal and metal-to-honeycomb components
• High-fracture toughness and peel strength
• Improved resistance to high moisture pre-cure conditions

3M™ Scotch-Weld™ Structural Adhesive Film AF 3109-2 is a thermosetting, modified epoxy adhesive film. Scotch-Weld AF 3109-2 film was designed for bonding honeycomb and metal-to-metal components where high strength at 300°F (149°C) is required.

A thermosetting, modified epoxy structural adhesive film designed for bonding applications requiring high shear and peel strength at 250°F (121°C)