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Making the right circuit board connections
September 02, 2016
Making the right circuit board connections
Engineers, designers and system integrators now have a quick and easy way to learn the benefits of 3M’s latest wire-to-board system with the launch of a video featuring computer generated imagery.
Making the right circuit board connections
Engineers, designers and system integrators now have a quick and easy way to learn the benefits of 3M’s latest wire-to-board system with the launch of a video featuring computer generated imagery.
Making the right circuit board connections
Engineers, designers and system integrators now have a quick and easy way to learn the benefits of 3M’s latest wire-to-board system with the launch of a video featuring computer generated imagery.
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A two minute video featuring 360° graphics has been developed to showcase the key system attributes, advantages and benefits of the high density 3M™ Wire-to-Board System, 450 Series.
Used to connect wires to printed circuit boards, the system is based on Insulation Displacement Contact (IDC) technology and has been designed to save space without sacrificing connection density.
The cost effective system provides a number of flexible design options and offers proven and reliable connection and termination capabilities.
3M has more than 50 years’ experience in interconnect solutions and is a leading manufacturer of board-to-board, wire-to-board, backplane and input/output (I/O) applications.
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