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  6. 3M™ Light-To-Heat-Conversion Release Coating

3M™ Light-To-Heat-Conversion Release Coating

  • 3M ID B00042821

Enables stress free, room temperature debonding of adhesive to glass carrier interface with laser irradiation

Compatible with typical semiconductor chemistries and processes

Compatible with the 3M™ Wafer Support System

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Frequently viewed resources
Tech Data Sheet (PDF, 70KB)

Required products

3M(TM) Wafer De-Taping Tape 3305 and 879
Required to Use
3M™ Polyester Delaminating Tape 3305
3M(TM) UV-Curable Adhesive LC-3200, LC-4200 and LC-5200
Required to Use
3M™ UV-Curable Adhesive LC-3200
3M(TM) Wafer De-Taping Tape 3305 and 879
Required to Use
3M™ Wafer De-Taping Tape 879

Details

Highlights
  • Enables stress free, room temperature debonding of adhesive to glass carrier interface with laser irradiation
  • Compatible with typical semiconductor chemistries and processes
  • Compatible with the 3M™ Wafer Support System
  • Applied using spin coating methods

3M™ Light-To-Heat-Conversion Release Coating (LTHC) ink is a solvent based coating applied using a spin coating method. This coating forms the light to heat conversion layer on a glass substrate for 3M™ Wafer Support System.

Specifications

Resources

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