3M™ Thermally Conductive Interface Pad Sheet 5595
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Details
Highlights
- Good thermal stability of the base polymer with excellent softness of the thermal pad
- Good thermal conductivity in a soft silicone polymer base
- The product tack is such that a mechanical means to support the pad in a final assembly is required
- Use ‘S’ versions for improved handling
- Get improved dielectric strength
3M™ Thermally Conductive Silicone Interface Pad 5595 is a soft, silicone elastomer with thermal conductivity of 1.6 W/m-K. Conformable at low pressure to minimize stress on components and fill gaps. Good dielectric properties.
Because of its softness, Interface Pad can decrease the load to integrated circuit chips during compression, and have good tack to many surfaces. These properties lead to a high performance non-silicone based thermal pad.
Suggested applications
- Provide heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices
Specifications
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