3M™ Polyimide Film Tape 5413

  • Options available
  • | Select product options for IDs.

The DuPont™ Kapton® polyimide film does not soften at elevated temperatures, thus the film provides an excellent release surface at elevated temperatures

Is dimensionally stable at high temperatures, which prevents rework, enabling high productivity

Is flame retardant, chemical and radiation resistant which protects surfaces to help reduce replacement costs

View more details
Frequently viewed resources
Tech Data Sheet (PDF, 116KB)Safety Data Sheet (HTML, 0B)

Details

Highlights
  • The DuPont™ Kapton® polyimide film does not soften at elevated temperatures, thus the film provides an excellent release surface at elevated temperatures
  • Is dimensionally stable at high temperatures, which prevents rework, enabling high productivity
  • Is flame retardant, chemical and radiation resistant which protects surfaces to help reduce replacement costs
  • The silicone adhesive's high temperature performance reduces adhesive transfer which helps to eliminate cleaning, enabling high productivity
  • Available on cardboard or polyethyelene core

3M™ Polyimide Film Tape 5413 is made with polyimide film and a silicone adhesive. It is used for PCB solder masking and other high temperature applications.

"Use 3M™ Polyimide Film Tape 5413 for PCB solder masking and other high temperature applications within a range of 73 °C to 260 °C. This amber coloured, 2.7 mil thick tape is made with an polyimide film and a silicone adhesive. It also features a polyethylene tape core instead of cardboard. The silicone adhesive's high temperature performance reduces adhesive transfer which helps eliminate cleaning, allowing you to keep productivity high. Polyimide film provides an excellent release as it doesn’t soften and stays dimensionally stable at high temperatures – preventing rework. Surfaces are protected due to this tapes flame retardancy, chemical and radiation resistance, reducing replacement costs."

Suggested applications
  • Use for masking protection of gold fingers of printed circuit boards during wave solder or solder dip process
  • Release surface in fabrication of parts cured at elevated temperature

Specifications

Resources

Connect with us. We’re here to help.

Need help finding the right product for your project? Contact us if you need product, technical or application advice or want to collaborate with a 3M technical specialist

Send Us a Message

Thank you for your interest in 3M. In order to help us manage and respond to your query effectively, we politely ask you to provide some key information, including your contact details. The information you provide will be used to respond to your request through email or telephone by a 3M representative or one of our authorised business partners with whom we might share your personal information consistent with the 3M privacy policy

  •  
  •  
  •  
  •  
  •  
  • 3M takes your privacy seriously. 3M and its authorized third parties will use the information you provided in accordance with our Privacy Policy to send you communications which may include promotions, product information and service offers. Please be aware that this information may be stored on a server located in the U.S. If you do not consent to this use of your personal information, please do not use this system.

  • Send Message

Thank you for your contacting 3M

We have received your message and are now looking into your enquiry
One of our representatives will get in touch with you by phone or email

An error occurred.