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  6. 3M™ Trizact™ CMP Pad

3M™ Trizact™ CMP Pad

  • 3M ID B40045199

Precisely engineered three-dimensional microreplicated asperities and pores, helps to ensure uniform asperity diameter and height and pore depth.

An innovative groove design helps provide efficient and uniform slurry flow distribution.

The controlled microreplicated features helps ensure consistent performance pad-to-pad to meet the demands of advanced node CMP processes.

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Details

Highlights
  • Precisely engineered three-dimensional microreplicated asperities and pores, helps to ensure uniform asperity diameter and height and pore depth
  • An innovative groove design helps provide efficient and uniform slurry flow distribution
  • The controlled microreplicated features helps ensure consistent performance pad-to-pad to meet the demands of advanced node CMP processes

3M™ Trizact™ CMP Pad uses microreplication technology to help provide precise asperity control for low defectivity and consistent pad performance throughout pad life.

An innovative pad for Chemical Mechanical Polishing (CMP) for advanced node semiconductor manufacturing.

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