|
|
---|---|
Chemical Base
|
Epoxy
|
Composition
|
Solvent Based
|
Cure Temperature
|
Elevated Temperature
|
Market Segment
|
Structures
|
Percent Volatile
|
80-90 Percent by Weight
|
Product Type
|
Primer
|
Storage Environment
|
Room Temperature
|
Surface Treatment
|
No
|
Surface Type
|
Metal
|
Volume (metric)
|
3.79 L
|
3M developed the 3M™ Scotch-Weld™ Structural Adhesive Primer EC-2333 for improved adhesion and to promote long-term durability for joints in metal bonding applications. This solvent-based specialized adhesive primer is especially effective with 3M™ Scotch-Weld™ Structural Adhesive AF 130-2 and AF 143-2.
3M™ Scotch-Weld™ Structural Adhesive Primer EC-2333 helps ensure complete wetting of the film adhesive system to bonding surfaces and improves durability of the film adhesive. The EC-2333 provides a high degree of protection against corrosive environments, both inside and outside the adhesive bondline, and is designed for optimal performance when used with 3M™ Scotch-Weld™ Bonding Films, particularly the nitrile phenolic Scotch-Weld AF 130-2 and AF 143-2. When cured with a 350°F adhesive film, it helps promote long-term durability for bonded metal joints. EC-2333 retains high shear strength to 400°F 204°C when used with Scotch-Weld AF 130-2 and AF 143-2.