3M™ Scotch-Weld™ Structural Adhesive Film AF 555

  • 3M ID 7000058926
  • UPC 00048011532288

Designed for 350°F cure (175°C)

Offers pre-bond humidity performance on composite substrates

One year out time at ambient conditions

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Frequently viewed resources
Safety Data Sheet (PDF, 0B)

Details

Highlights
  • Designed for 350°F cure (175°C)
  • Offers pre-bond humidity performance on composite substrates
  • One year out time at ambient conditions
  • Excellent shop handling characteristics

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Specifications

Resources