3M™ Scotch-Weld™ Epoxy Adhesive EC-2214 Hi-Temperature NF

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  • New formulation has significantly improved reactivity for consistent results during cure cycle
  • Dense, aluminum filled formula is ideal for metal-to-metal bonding, exterior and structural applications
  • Dense, aluminum filled formula is ideal for metal-to-metal bonding, exterior and structural applications
  • One-part formula requires no mixing
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Container Size (Metric)
1 Litre, 168.96 g
Product Colour
Grey
Product Details
  • New formulation has significantly improved reactivity for consistent results during cure cycle
  • Dense, aluminum filled formula is ideal for metal-to-metal bonding, exterior and structural applications
  • Dense, aluminum filled formula is ideal for metal-to-metal bonding, exterior and structural applications
  • One-part formula requires no mixing
  • Smooth, high-density paste consistency is easy to dispense where precision bond lines are desired

3M™ Scotch-Weld™ Structural Void Filling Compound EC-3550 B/A FST (Fire Smoke Toxicity) is an advanced technology compound developed to help cut production cost and time, reduce weight and address safety regulations governing aircraft interiors. The lightweight, low density product helps eliminate process steps, reduces worker touch time and speeds throughput compared to hand mixing and applying.

3M™ Scotch-Weld™ Epoxy Adhesive EC-2214 Hi-Temperature NF (new formulation) is a convenient, one-part, heat cured paste that dispenses easily for precise bond lines and negligible shrinkage. It is an aluminum filled, one-part, heat-cure, modified epoxy that we formulated as a thixotropic paste for easy dispensing. When warmed, the adhesive flows smoothly for precise dispensing and neat, clean bond lines. It heat cures between 250-300°F (121-149°C). Using this high temperature formula, high strength bonds are obtained on many metals, glass and some plastics, with negligible shrinkage. It is an ideal choice for metal-to-metal bonding for exterior and structural applications. It can also be used for potting and encapsulating components and for strengthening honeycomb panels and structures. This one-part epoxy is the go-to choice when a void free bond line is required on composite and metal bonding in operating temperatures between 180-350°F (82-177°C).

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