3M™ Scotch-Weld™ Structural Adhesive Film AF 163-2
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Details
Highlights
- Designed for 250°F (120°C) cure
- Adhesive can be cured from 180°F (80°C) up to 300°F (150°C)
- Excellent shop handling characteristics
- Excellent pre-bond humidity performance on composite substrates
- Reduces Aircraft on Ground time (AOG); short cure time at 225°F (107°C) in 90 minutes
Helps to reduces cost; simplifies production and inventory management due to use on multiple substrates and compatibility with a variety of primers
Specifications
Resources
