|
|
---|---|
Abrasive Working Surface
|
Full Face
|
Applications
|
CMP
|
Bristle Diameter
|
0.005 in, 0.012 in
|
Brush Material-Density
|
Nylon, >1200/sq in, Nylon, >2000/sq in
|
Carrier Color
|
Black
|
Carrier Format
|
Disk
|
Carrier Material
|
Polycarbonate
|
Carrier Size
|
4.25 inch diameter
|
CMP Process
|
Cu (barrier), Final Buff, W (buff)
|
Mineral Type
|
Nylon Fibers
|
Product Series
|
PB32A, PB33A, PB52A
|
Product Type
|
Pad Conditioner Brush
|
Type
|
Brush
|
Engineered CMP pad conditioner brushes are designed for critical semiconductor buff CMP applications.
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