- Durable brush bristles assist with removal of pad debris from microreplicated, porometric and felt-based pads
- Easy connection to polishing tool end effector
- Exclusive polymer substrate enhances corrosion resistance
- Efficient pad cleaning and slurry distribution helps enable low cost of ownership
Specifications
|
|
|
|---|---|
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Abrasive Working Surface
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Full Face
|
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Applications
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CMP
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|
Bristle Diameter
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0.005 in, 0.012 in
|
|
Brush Material-Density
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Nylon, >1200/sq in, Nylon, >2000/sq in
|
|
Carrier Color
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Black
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|
Carrier Format
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Disk
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Carrier Material
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Polycarbonate
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Carrier Size
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4.25 inch diameter
|
|
CMP Process
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Cu (barrier), Final Buff, W (buff)
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Mineral Type
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Nylon Fibers
|
|
Product Series
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PB32A, PB33A, PB52A
|
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Product Type
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Pad Conditioner Brush
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|
Type
|
Brush
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Product Details
- Durable brush bristles assist with removal of pad debris from microreplicated, porometric and felt-based pads
- Easy connection to polishing tool end effector
- Exclusive polymer substrate enhances corrosion resistance
- Efficient pad cleaning and slurry distribution helps enable low cost of ownership
Engineered CMP pad conditioner brushes are designed for critical semiconductor buff CMP applications.
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