3M™ Trizact™ Pad Conditioner

Products
  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disk life
  • Diamonds secured with both chemical and mechanical bonds for superior retention
  • Exclusive polymer substrate enhances corrosion resistance
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Carrier Size
Carrier_Size
Diamond Type
Diamond_Type
Aggressiveness
Aggressiveness
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 Carrier Size, Diamond Type  Aggressiveness
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Specifications
Abrasive Working Surface
Ring Face
Aggressiveness
18-24
Applications
CMP
Carrier Color
Black
Carrier Format
Disk - with bevel edge
Carrier Material
304 Stainless Steel, Polycarbonate
Carrier Size
4.25 inch diameter
CMP Process
Cu (bulk)
Diamond Size
181 um
Diamond Type
Type 4, semi-sharp
Manufacturing Location
United States
Mineral Type
Nickel based alloy with patterned diamond
Product Series
A2800
Product Type
Diamond Pad Conditioner
Product Details
  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disk life
  • Diamonds secured with both chemical and mechanical bonds for superior retention
  • Exclusive polymer substrate enhances corrosion resistance

Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for superior diamond retention, with controlled diamond placement and protrusion.

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