Enjoy effective conditioning for metal-sensitive processes. 3M™ CMP Pad Conditioner Coatings are a durable layer over the pad conditioner, which can help reduce metal leaching by up to 75%. The coating combines with powerful 3M sintered abrasive technology to further minimize micro and macro scratching defects.
3M™ Diamond Pad Conditioner C Series is a highly engineered chemical mechanical planarization (CMP) pad conditioner that helps you deliver reliable performance in your critical semiconductor CMP applications. Refresh your CMP pad surfaces with 3M™ Diamond Pad Conditioner C Series. It also minimizes wear and maintains consistent asperities and consistent pad performance — for wafer after wafer. These diamond disk conditioners use 3M proprietary sintered abrasive technology for excellent diamond retention, helping enable longer life and better shape and diamond orientation control than legacy diamond pad conditioners. The improved consistency and smaller variation enable you to reduce variables and optimize your CMP performance.
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