3M™ Diamond Pad Conditioner C Series

  • 3M ID B5005469001

Optimized diamond shape, pitch control and diamond orientation

Improved consistency and reduced disk-to-disk variation

Slower pad wear rate decay with stable removal rate and profile

View more details
Frequently viewed resources
PDF (1) Copy 26Tech Data Sheet (PDF, 176KB)
Graphic highlighting  CMP pad conditioner coating for metal-sensitive processes.
3M™ CMP Pad Conditioner Coatings

Enjoy effective conditioning for metal-sensitive processes. 3M™ CMP Pad Conditioner Coatings are a durable layer over the pad conditioner, which can help reduce metal leaching by up to 75%. The coating combines with powerful 3M sintered abrasive technology to further minimize micro and macro scratching defects.

Details

Highlights
  • Optimized diamond shape, pitch control and diamond orientation
  • Improved consistency and reduced disk-to-disk variation
  • Slower pad wear rate decay with stable removal rate and profile
  • Enables potential for longer disk life and pad life
  • Uses 3M sintered abrasive technology for firm diamond adhesion
  • 40% improvement in flatness control over legacy designs

3M™ Diamond Pad Conditioner C Series is a highly engineered chemical mechanical planarization (CMP) pad conditioner that helps you deliver reliable performance in your critical semiconductor CMP applications. Refresh your CMP pad surfaces with 3M™ Diamond Pad Conditioner C Series. It also minimizes wear and maintains consistent asperities and consistent pad performance — for wafer after wafer. These diamond disk conditioners use 3M proprietary sintered abrasive technology for excellent diamond retention, helping enable longer life and better shape and diamond orientation control than legacy diamond pad conditioners. The improved consistency and smaller variation enable you to reduce variables and optimize your CMP performance.

  •  Icon of three CMP pads representing improved consistency
    Improved Consistency
  • Icon of a cross-section of CMP pad showing diamond height representing optimized topography
    Optimized Topography
  • Icon of a diamond pad next to a checklist representing tunable performance.
    Tunable Performance
3M CMP products mapped out by disk aggressiveness and pad roughness
Broad range of conditioning performance options

Extra-precise diamond placement

  • Microscopic image showing legacy diamond placement next to a graphic showing diamond height inconsistencies.
    Legacy 3M pad conditioner
  • Microscopic image showing new diamond placement next to a graphic showing diamond height consistency.
    3M™ Diamond Pad Conditioner C Series
Advanced Node (Memory & Logic), CMP and Wafer Manufacturing icons

Specifications

Resources

Connect with us. We’re here to help.

Need help finding the right product for your project? Contact us if you need product, technical or application advice or want to collaborate with a 3M technical specialist

Send Us a Message

Thank you for your interest in 3M. In order to help us manage and respond to your query effectively, we politely ask you to provide some key information, including your contact details. The information you provide will be used to respond to your request through email or telephone by a 3M representative or one of our authorised business partners with whom we might share your personal information consistent with the 3M privacy policy

  •  
  •  
  •  
  •  
  •  
  • 3M takes your privacy seriously. 3M and its authorized third parties will use the information you provided in accordance with our Privacy Policy to send you communications which may include promotions, product information and service offers. Please be aware that this information may be stored on a server located in the U.S. If you do not consent to this use of your personal information, please do not use this system.

  • Send Message

Thank you for your contacting 3M

We have received your message and are now looking into your enquiry
One of our representatives will get in touch with you by phone or email

An error occurred.


Frequently asked questions

3M uses a proprietary sintered abrasive process that attaches diamonds to the substrate with both chemical and mechanical bonds to enhance diamond retention.
Selecting a pad conditioner requires compatibility testing to confirm that your pad, wafer and slurry combination will perform optimally. Our technical team has data packages for many common chemistries – tungsten to copper, poly to STI, and many more – that have been proven compatible with our products. We can also test custom combinations at our labs around the world.
3M™ Diamond Pad Conditioner C Series elevates our more than 25 years of experience with diamond pad conditioners to a new level of precision. Diamonds are placed in a precise grid at the micrometer scale, and oriented to maximize flatness, co-planarity and conditioning performance.
Submit the Contact a Sales Rep form on this page or any other 3M CMP materials webpage, and our team will get in touch with you to discuss your needs.