3M™ Scotch-Weld™ Structural Adhesive Film AF 3109-2K .085WT High Tack, 48 in x 25 yds, 1 per case
3M ID 7000000842
- Liquid, sprayable structural adhesive with improved high temperature performance compared to conventional 250°F (121°C) curing adhesives.
- Allows for flexibility in design; durable in a wide range of service conditions, high performance from -67°F to 250°F (-55°C to 121°C)
- Scotch-Weld AF 3109-2 can be used with 3M™ Scotch-Weld™ Structural Adhesive Primer EC-3960.
- Excellent strength from -67°F (-55°C) to 300°F (149°C) in either metal-to-metal or honeycomb sandwich applications. Compatible with most epoxy-graphite composites.
Specifications
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Adhesive Type
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Epoxy
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Capabilities
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Aircraft Maintenance & Production Efficiency
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Cure Rate
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1 Hour
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Cure Temperature
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250/350 Degree Fahrenheit
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Defense Products Market Segments
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Land Systems
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Market Segment
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Structures
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Maximum Operating Temperature (Celsius)
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150 Degree Celsius
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Nominal Weight
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0.085 lb/ft²
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Overall Length (Metric)
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23 m
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Overall Width (Metric)
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1.2 m
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Product Colour
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Blue
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Shelf Life
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6 Month
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Storage Environment
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Freezer Storage
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Product Details
- Liquid, sprayable structural adhesive with improved high temperature performance compared to conventional 250°F (121°C) curing adhesives.
- Allows for flexibility in design; durable in a wide range of service conditions, high performance from -67°F to 250°F (-55°C to 121°C)
- Scotch-Weld AF 3109-2 can be used with 3M™ Scotch-Weld™ Structural Adhesive Primer EC-3960.
- Excellent strength from -67°F (-55°C) to 300°F (149°C) in either metal-to-metal or honeycomb sandwich applications. Compatible with most epoxy-graphite composites.
- Helps streamline production; range of curing temperature from 225°F (107°C) to 350°F (176°C)
- Epoxy designed for bonding composites, metal-to-metal and metal-to-honeycomb components.
- Unsupported version available; can be used for reticulation onto honeycomb core
3M™ Scotch-Weld™ Structural Adhesive Film AF 3109-2 is a thermosetting, modified epoxy adhesive film. Scotch-Weld AF 3109-2 film was designed for bonding honeycomb and metal-to-metal components where high strength at 300°F (149°C) is required.
A thermosetting, modified epoxy structural adhesive film designed for bonding applications requiring high shear and peel strength at 250°F (121°C)
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