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  6. 3M™ Scotch-Weld™ Core Splice Adhesive EC-3500 B/A

3M™ Scotch-Weld™ Core Splice Adhesive EC-3500 B/A

Products
  • Low density
  • Designed for filling mismatched areas and reinforcing honeycomb core
  • Low volatile loss during cure
  • Low density and long work life ensures time for positioning and adjustments
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Specifications
Adhesive Type
Epoxy
Application Life
60 Minute
Chemical Base
Epoxy
Cure Temperature
250/350 Degree Fahrenheit
Flame Retardant
No
Market Segment
Structures
Product Key
EC3500
Storage Environment
Room Temperature
Product Details
  • Low density
  • Designed for filling mismatched areas and reinforcing honeycomb core
  • Low volatile loss during cure
  • Low density and long work life ensures time for positioning and adjustments
  • Offers excellent shear strength even at elevated temperatures
  • Cures from 120oC to 175oC in one hour

3M Scotch-Weld Core Splice Adhesive EC-3500 B/A provides a solution to core splicing, filling mismatched areas and reinforcing honeycomb core. It is a two-part, modified epoxy adhesive paste with a low density and low volatile loss during cure. This ensures the adhesive retains a consistent and thorough bond even after curing. This adhesive provides high performance over a broad range of temperatures ranging from -67°F-350°F (-55°C-177°C). 3M™ Scotch-Weld™ Core Splice Adhesive EC-3500 B/A features good shear and compression strength to ensure bonded substrates continue to perform as expected, even under stress and vibration. Even at high temperatures, the adhesive retains good core shear strength.