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  6. 3M™ Scotch-Weld™ Structural Void Filling Compound EC-3460 HT FST

3M™ Scotch-Weld™ Structural Void Filling Compound EC-3460 HT FST

  • Extrudable through both cartridge and dispensing system
  • High compressive strength from -55oC to 175oC
  • Meets stand-alone FAR / JAR 25.853 and ABD 0032
  • 101 percent solids and free of shrinkage
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Specifications
Adhesive Type
Epoxy
Product Form
Can, Cartridge
Product Details
  • Extrudable through both cartridge and dispensing system
  • High compressive strength from -55oC to 175oC
  • Meets stand-alone FAR / JAR 25.853 and ABD 0032
  • 101 percent solids and free of shrinkage
  • Cures to a rigid, solvent resistant material in one hour at 125°C or 175°C
  • Non-halogenated, no intentionally added antimony
  • 100% solids with no shrinkage

It is designed for use on honeycomb sandwich structures as edge close out, corner reinforcement, local reinforcement for mechanical fixation, or complex gap filling.