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  6. 3M™ Scotch-Weld™ Epoxy Adhesive EC-2214 Hi-Temperature NF, 1 l, 2 Can/Case

3M™ Scotch-Weld™ Epoxy Adhesive EC-2214 Hi-Temperature NF, 1 l, 2 Can/Case

  • 3M Product Number EC-2214
  • 3M ID 7100116496
  • UPC 04054596263178

New formulation has significantly improved reactivity for consistent results during cure cycle

High temperature formula provides negligible shrinkage and strong bond where higher strengths are required between 180-350° F (82-177° C)

Dense, aluminum filled formula is ideal for metal-to-metal bonding, exterior and structural applications

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Details

Highlights
  • New formulation has significantly improved reactivity for consistent results during cure cycle
  • High temperature formula provides negligible shrinkage and strong bond where higher strengths are required between 180-350° F (82-177° C)
  • Dense, aluminum filled formula is ideal for metal-to-metal bonding, exterior and structural applications
  • One-part formula requires no mixing
  • Smooth, high-density paste consistency is easy to dispense where precision bond lines are desired

3M™ Scotch-Weld™ Epoxy Adhesive EC-2214 Hi-Temperature NF (new formulation) is a convenient, one-part, heat cured paste that dispenses easily for precise bond lines and negligible shrinkage. It is an aluminum filled, one-part, heat-cure, modified epoxy that we formulated as a thixotropic paste for easy dispensing. When warmed, the adhesive flows smoothly for precise dispensing and neat, clean bond lines. It heat cures between 250-300°F (121-149°C). Using this high temperature formula, high strength bonds are obtained on many metals, glass and some plastics, with negligible shrinkage. It is an ideal choice for metal-to-metal bonding for exterior and structural applications. It can also be used for potting and encapsulating components and for strengthening honeycomb panels and structures. This one-part epoxy is the go-to choice when a void free bond line is required on composite and metal bonding in operating temperatures between 180-350°F (82-177°C).

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