- Precisely engineered 3D microreplicated ceramic structures coated with CVD diamond
- Accurately controlled microreplicated structures
- Consistent performance disk-to-disk and the metal-free cutting surface
- Ideal for advanced node processes sensitive to metallic contamination
Specifications
|
|
|
|---|---|
|
Abrasive Working Surface
|
B5-M990 pattern
|
|
Applications
|
CMP
|
|
Brand
|
Trizact™
|
|
Carrier Color
|
Grey
|
|
Carrier Format
|
Stainless steel carrier - with universal mouting configuration
|
|
Carrier Material
|
304 Stainless Steel
|
|
Carrier Size
|
4.25 inch diameter
|
|
Carrier Substrate
|
304 SS
|
|
CMP Process
|
AL
|
|
Mineral Type
|
CVD coated ceramic
|
|
Product Series
|
B5-M990
|
|
Product Type
|
Diamond Pad Conditioner
|
Product Details
- Precisely engineered 3D microreplicated ceramic structures coated with CVD diamond
- Accurately controlled microreplicated structures
- Consistent performance disk-to-disk and the metal-free cutting surface
- Ideal for advanced node processes sensitive to metallic contamination
Bringing together 3M’s know-how in abrasives, ceramics and microreplication, the 3M™ Trizact™ Pad Conditioner is an innovative pad conditioner for Chemical Mechanical Polishing (CMP) for advanced node semiconductor manufacturing.
Documents
