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  6. 3M™ Polyimide Film Tape 5413, Gold, 635 mm x 33 m x 0.07 mm, 1 Roll/Case

3M™ Polyimide Film Tape 5413, Gold, 635 mm x 33 m x 0.07 mm, 1 Roll/Case

  • 3M ID 7100135111
  • UPC 00051115117855
Overall Width (Metric) 635 mm
Total Tape Thickness without Liner (metric) 0.069 mm
Overall Width (Imperial) 25 in
Total Tape Thickness without Liner (Imperial) 2.7 mil
Product Colour Amber
Overall Length (Imperial) 36 yd

Reliable during intense heat applications helping customers with their operational efficiency

Dimensional stability at high temperatures helps prevent rework, potentially enabling higher productivity

Helps reduce risk of adhesive residue providing customers with a clean surface after removal

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PDF (1) Copy 26Tech Data Sheet (PDF, 116KB)

Details

Highlights
  • Reliable during intense heat applications helping customers with their operational efficiency
  • Dimensional stability at high temperatures helps prevent rework, potentially enabling higher productivity
  • Helps reduce risk of adhesive residue providing customers with a clean surface after removal
  • Offers robust protection against harsh chemicals potentially extending the life of the substrate
  • Available on cardboard or polyethyelene core

3M™ Polyimide Film Tape 5413 is for high-temperature applications, offering robust performance as high-temperature tape and high-temperature silicone adhesive tape. It effectively helps reduce adhesive transfer, helping customers simplify cleanup and enhancing productivity. With its dimensional stability, the 3M tape 5413 also withstands extreme heat.

Use 3M™ Polyimide Film Tape 5413 for PCB solder masking and other high temperature applications within a range of -73 °C to 260 °C. This amber coloured, 2.7 mil thick tape is made with an polyimide film and a silicone adhesive. It also features a polyethylene tape core instead of cardboard. The silicone adhesive's high temperature performance reduces adhesive transfer which helps eliminate cleaning, allowing you to keep productivity high.Polyimide film provides an excellent release as it doesn’t soften and stays dimensionally stable at high temperatures – preventing rework. Surfaces are protected due to this tapes flame retardancy, chemical and radiation resistance, reducing replacement costs.

Suggested applications
  • Use for masking protection of gold fingers of printed circuit boards during wave solder or solder dip process
  • Release surface in fabrication of parts cured at elevated temperature

Specifications

Resources

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