3M™ Boron Nitride Cooling Filler Platelets

3M™ Boron Nitride Cooling Filler platelets are single boron nitride particles that orient during processing of polymer compounds, and deliver high heat spreading capabilities to finished parts. These platelets are excellent for helping improve in-plane thermal conductivity of thermoplastics and thermosets, and are available in grades that are a better option for injection molding applications. Highly crystalline particles are as small as 0.5 µm. Electrically insulating platelets are available in all-purpose grades for a variety of applications. 3M BN cooling filler platelets can be an alternative to mineral- and oxide-based compound fillers.

• 

  Excellent Heat Spreading
• 

  High In-plane Conductivity
• 

  May Reduce System Costs by Allowing System Integration
• 

  Versatile for Many Applications

• 
• Excellent for in-plane conductivity

  3M BN cooling filler platelets are a great choice for applications requiring high in-plane heat spreading capabilities in thermoplastics. Some grades of platelets are particularly better for thermosets and can be used in potting resins as well as thermal pads and thin films. Several grades are available specifically for the flowability and processability required for extruded and injection molded plastic parts.

  A complete selection of 3M™ Boron Nitride Cooling Fillers includes platelets, flakes and agglomerates to meet a full range of performance specifications for in-plane and through-plane thermal conductivity.

Grades of 3M™ Boron Nitride Cooling Filler platelets

• 

  CFP 003E, 003, 006, 0075, 009 and 012

  All-purpose grades for injection molded parts.
• 

  CFP 001 and 003SF

  These grades are preferred for thin films of <25 µm, fibers, fine channels and motor windings. CFP 003SF has a controlled top size.
• 

  CFP 012P

  Spray-dried boron nitride platelets for excellent processability, flowability and high dosing velocities for extruded and injection molded parts.
• 

  CFP 007HS

  These platelets are ideal for thin films of <50 µm due to controlled top size. They deliver higher reflectivity and increased in-plane thermal conductivity for thermal pads.

Bulk density determined according to ASTM B329/ISO 3923-2 (Scott density) and according to ISO 23145-2 (DIN density)
Particle size distribution measured by laser light scattering (Mastersizer 2000, dispersion in ethanol)

* Particle size distribution measured by laser light scattering (Mastersizer 2000, dry, 0.1 bar)
** Data determined by means of SEM pictures
*** Can include soft agglomerates with 50-100 μm
For calculation purpose: Density of bulk hBN 2.25 g/cm³