3M™ Boron Nitride Cooling Filler Agglomerates

  • 3M ID B5005473000

Randomly orientated agglomerated single platelets for high through-plane thermal conductivity

Delivers excellent heat dissipation for protection of sensitive components

Isotropic heat transfer compared to platelets

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Tech Data Sheet (PDF, 2MB)

Details

Highlights
  • Randomly orientated agglomerated single platelets for high through-plane thermal conductivity
  • Delivers excellent heat dissipation for protection of sensitive components
  • Isotropic heat transfer compared to platelets
  • Soft bulk agglomerates adapt to matrix, helping maintain flexibility
  • Excellent for conformable thermal interface materials (TIMs)
  • High electrical insulation properties with low Dk and Df

3M™ Boron Nitride Cooling Filler agglomerates are randomly oriented agglomerates of crystalline boron nitride single platelets. Featuring excellent heat transfer capabilities, these agglomerates can help achieve much higher W/m*K vs. mineral or oxide fillers. Soft agglomerates adapt to the flexibility of the polymer matrix. 3M™ BN cooling filler agglomerates are especially good for thin thermal interface materials (TIMs) requiring consistent heat transfer and high through-plane conductivity.

  • Icon of a droplet with two arrows circling it for a Compound Viscosity Control.
    Compound Viscosity Control
  • Spring icon for conformability.
    Conformability
  • Temperature gauge icon for excellent heat dissipation.
    Excellent Heat Dissipation
  • Icon of an arrow pointing down through a box showing high through-plan conductivity.
    High Through-plane Conductivity
  • Graphic showing how 3M BNCF Agglomerates are a great choice for applications requiring high through-plane heat dissipation and consistent heat transfer.
  • Excellent for through-plane conductivity

    3M™ BN cooling filler agglomerates are a great choice for applications requiring high through-plane heat dissipation and consistent heat transfer. Randomly-oriented agglomerated platelets create isotropic thermal conductivity that performs even for very thin materials. Agglomerates are excellent for Thermal Interface Materials (TIMs) and other applications requiring dissipation of heat away from valuable components such as chips, LEDs, CPUs and EV battery cells.

    A complete selection of 3M™ Boron Nitride Cooling Fillers includes platelets, flakes and agglomerates can meet a full range of performance specifications for in-plane and through-plane thermal conductivity.

Grades of 3M™ Boron Nitride Cooling Filler agglomerates:

  • 3M™ Boron Nitride Cooling Filler Agglomerates CFA 50M
    CFA 50M
    A mix (M) of agglomerates, platelets and boron nitride clusters is excellent for potting resins and encapsulation of electronic devices.
  • 3M™ Boron Nitride Cooling Filler Agglomerates CFA 250S
    CFA 250S
    Boron nitride platelets are spray-dried with an inorganic binder to spherical (S) granulates for high flowability and dosing velocities during feeding. They are ideal for thermal interface management (TIM) pads.
  • 3M™ Boron Nitride Cooling Filler Agglomerates CFA 150
    CFA 150
    Soft agglomerates allow for high filler loadings and isotropic thermal conductivity. CFA 150 is used for potting resins and conformable TIM foils or pads with thin bond lines above 200 µm.
  • 3M™ Boron Nitride Cooling Filler Agglomerates CFA 100
    CFA 100
    Soft agglomerates deliver the same uses and benefits as CFA 150, but can be used for materials with thinner bond lines from 150-200 μm.
  • 3M™ Boron Nitride Cooling Filler Agglomerates CFA 75
    CFA 75
    Soft agglomerates deliver the same uses and benefits as CFA 100, but can be used for materials with bond lines as thin as 100-150 μm.
Table showing bulk density determined according to ASTM B329/ISO 3923-2 (Scott density) and according to ISO 23145-2 (DIN density).

Bulk density determined according to ASTM B329/ISO 3923-2 (Scott density) and according to ISO 23145-2 (DIN density)
Particle size distribution measured by laser light scattering (Mastersizer 2000, dispersion in ethanol)
For calculation purpose: Density of bulk hBN 2.25 g/cm³

Recommended applications banner with three icons: A lightning bolt in a circle crossed out for “electrical insulating”, a thermometer for “increasing thermal conductivity”, and 2/5 signal bars for “minimizing signal loss” applications.

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