Header graphic displaying semiconductor dies on a wafer being inspected.
Process protection

Higher production. Less waste. New possibilities.

CONNECT WITH A 3M EXPERT

3M solutions for semiconductor advanced packaging process protection

  • With emerging technologies including 5G, autonomous driving, IoT and others creating an even greater demand for high performance computing and device connectivity, a driving force has been created that will shape the next several generations of technology and design innovation. Semiconductor chips must be smaller, thinner, faster and more functional. Advanced IC packaging is key to helping enable the performance needs but requires more and newer processes than ever before – and involves more chemicals, more films, and more extreme processing conditions. Learn how 3M can help.


Close  

Protecting more than just processes

  • 3M delivers process protection solutions that help improve your total cost of ownership, including chip yield and process time. Backed by decades of experience in adhesives and electronics, our experts can help you maximise processes for today and for what’s next – heterogenous and integrated die packaging, multiple die stacks and chiplet processing to name a few. Our solutions also help enable the integration of components like sensors, diodes, advanced substrates and more.

  • Key trends in semiconductor advanced packaging

    Embedded die in substrate
    A popular option for reducing form factor is embedded die in substrate. This innovative approach implants the IC within a laminate substrate, which can then be situated next to other components (other dice, MEMs, etc.) using copper-plated vias resulting in an integrated, multi-functional package.

    Heat resistant and chemical resistant process protection solutions from 3M can enable the thermal and chemical processing steps of embedded die in substrate technology.


Discover 3M process protection solutions

Our solutions are designed for a broad range of processes including FOPoP, D2W hybrid bonding, RDL-last processes and others.

Sensor protection

Explore sensors in new surroundings

Expanded possibilities in semiconductor design

  • Heat resistant polyimide tapes for semiconductor IC packaging process protection.

    3M™ Heat Resistive Polyimide Tapes are excellent for helping protect sensors – valuable components which must endure extensive high-temperature and chemical processing steps in semiconductor assemblies. Not only that, they help you expand your design possibilities. These tapes are compatible with sensor housing materials such as diffusers, epoxy, poly amide, LCP and others, and bond without delamination or siloxane outgassing. They remove easily without residue, staining or static which can damage the substrate. Our semiconductor tapes for sensors meet clean room manufacturing standards.


Process flow for sensor protection

  • Step-by-step graphic of the sensor protection process flow.

    A. 3M™ Heat Resistive Polyimide Tape, B. Cover glass, C. Sensor chip, D. Housing

  • 1. Taping on sensor packages

    2. Reflow process for one or more cycles
     

    • Good heat resistance for multiple reflow cycles at 260 °C/500 °F without delamination
    • No siloxane outgas

    3. Dl water/solvents cleaning process

    4. Removal of tape and inspection of residue
     

    • Clean removal
    • Antistatic performance

QFN

High-performance lamination and masking solutions

Smoother, faster leadframe production

A selection of 3M leadframe tapes help speed production and reduce waste during die bonding, Au/Cu wire bonding and molding. Many of our heat-resistant QFN leadframe masking tape solutions are engineered to withstand the higher soldering temperatures required as the industry moves toward Cu wire bonding. Our laminating leadframe tapes deliver excellent ball shear performance, limiting die tilting and increasing throughput.


Process flow for leadframe tapes

  • Step-by-step graphic of the leadframe tape process flow.

    A. Leadframe, B. Die, C. Tape, D. Wire, E. Molding

  • 1. Tape lamination on leadframe
     

    • Easy lamination

    2. Die bonding
     

    • Good heat resistance (up to 210°C/410 °F, for 30 minutes)

    3. Au/Cu wire bonding
     

    • Good heat resistance (up to 230°C/446 °F, for 30 minutes)

    4. Plasma cleaning
     

    • Good plasma resistance (up to 30 minutes)

    5. Molding
     

    • Good heat resistance (up to 190°C/374 °F, for 5 minutes)
    • Good ball shear performance – less die tilt

    6. Dicing, tape removal and final product
     

    • Easy peel off
    • Clean removal on leadframe and molding component
    • Good plasma resistance for plasma cleaning


Product comparison table for heat resistance process tapes

• = Good •• = Better ••• = Best

*Peeling force on Cu
**Peeling force on bumped wafer


Connect with a 3M expert

Better protection is possible. We’ve got teams in key locations all over the globe dedicated to pushing the potential of our tapes.