3M CMP Pad Conditionersfor Semiconductor

Redefining CMP pad conditioners

Diamond, soft-brush and microreplicated CMP pad conditioners from 3M, developed with your toughest semiconductor fabrication challenges in mind.

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Consistent, reliable chemical mechanical planarization (CMP) pad conditioning

In the world of semiconductor fabrication, consistency, reliability and yield are critical at every part of the process. For over 25 years, 3M™ CMP Pad Conditioners have provided innovative pad conditioning solutions to some of the world’s leading semiconductor fabricators.

From the exclusive sintered abrasive diamond technology behind 3M™ Diamond Pad Conditioners to the precisely microreplicated patterns in 3M™ Trizact™ Pad Conditioners, our global technical team is committed to continually redefining the cutting edge of CMP polishing pad conditioner technology. Research and manufacturing facilities around the world provide convenient product support and product supplies.

3M™ Trizact™ Pad Conditioners

Metal-free cutting surface for advanced nodes

Enabled by proprietary microreplication process

3M™ Diamond Pad Conditioners

Diamond-studded metal disks

Reliable, controlled conditioner performance

3M™ CMP Pad Conditioner Brushes

Metal-free brushes

Economical pad cleaning
Download Product Selection Guide (ENGLISH, PDF, 2.6 MB)

Chart mapping 3M pad conditioner options by density and hardness.

A range of conditioners compatible with popular CMP pads

Our pad conditioners work with many common combinations of pad hardness and density. See what works best for you, or let our technical team test a custom specification.

Industry-shifting innovation in CMP pad conditioners

3M™ Trizact™ Pad Conditioner T Series

The T Series enhances the conventional 3M™ Trizact™ pad conditioner platform with a surface topography optimised for stronger pad activation, slower pad wear rate decay and even more consistent performance.
3M™ Diamond Pad Conditioner C Series

The C Series brings extra-precise diamond placement at the micrometer scale to further help control co-planarity and flatness for even more consistent performance in CMP pad conditioning.
3M™ CMP Pad Conditioner Coatings

Factory-applied to any 3M™ Diamond Pad Conditioner, 3M™ Diamond Pad Conditioner C Series, 3M™ Trizact™ Pad Conditioner or 3M™ Trizact™ Pad Conditioner T Series, these advanced coatings help limit defectivity from wafer scratching. In testing, they substantially reduced metal leaching by up to 75% compared to legacy disks.