Semiconductor Industry Solutions
Discover semiconductor industry solutions from 3M
Semiconductors are a key enabling technology, essential for modern electronic industry and other emerging applications, such as healthcare, transportation, clean energy, artificial intelligence, autonomous systems, 5G communications, and computing.
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Improving Semiconductor Processing and Handling
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If you are involved in semiconductor manufacturing and handling, you should be partnering with 3M. Our expertise in microreplication, nanotechnology, moulding and high purity isotopic materials provide solutions which help enable the uniformity, cleanliness and precision your processes demand.
For more than 50 years, 3M has been providing a wide range of materials to get you from start to finish in your process. That includes everything from materials used in etching and deposition, CMP and surface finishing materials for semiconductor wafer processing, tape and reel for chip transport and materials for wafer doping and ion implantation.
And when you partner with 3M, you have global support. Our technicians are there to help in key locations around the world.
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Semiconductor equipment, manufacturing and packaging solutions
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Drive productivity, lower cost of ownership and improve yields in CMP processes for current and advanced node semiconductor manufacturing with CMP pads and pad conditioners from 3M.
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Solutions for advanced IC packaging enable the latest semiconductor wafer and panel-level packaging processes and protect key components during intense high-temperature processing methods.
Discover 3M semiconductor advanced packaging solutions
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Shipping and storage can be hard on delicate components — high-precision tape and reel semiconductor solutions from 3M can help prevent damage and increase productivity.
3M brings precision, performance and efficiency to your manufacturing process.
3M product categories for semiconductor manufacturing
See 3M specific products that aim not only to improve the electronics we have today, but also to innovate and advance the technology of tomorrow.
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Adhesives for Temporary Wafer BondingEnabling faster, easier, more reliable ways to build tomorrow's semiconductors. 3M Wafer Support System (WSS) is proven in high‐volume manufacturing for temporary wafer bonding during wafer thinning and additional TSV processes.
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Boron Nitride Cooling FillersThese micro-structured additives literally improve the “cool factor” of electronics by helping conduct and dissipate heat in chip components.
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CMP Materials3M CMP and surface finishing materials can help increase productivity, improve yields and provide high quality process performance.
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Stable IsotopesUp to 99.9999% pure, these customisable boron dopants meet or exceed industry standards for high purity, and are helping expand R&D possibilities.
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Tape and ReelHelp protect your components during shipping and storage to meet your requirements and increase productivity.
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Test and Burn-In SocketsThe versatile product design helps enable reliable performance for test and burn-in applications.
Ready to redefine your CMP process?
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With trends like IoT, smart cities, connected transportation, mobile and edge computing driving our world, semiconductor devices that deliver more memory and speed are in demand. The pressure is on to improve performance and cost-effective consistency of the Chemical Mechanical Planarization (CMP) process of semiconductor manufacturing.
Learn more about how to advance your CMP process with 3M’s innovative CMP products.
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Ask a 3M Expert about Semiconductor Solutions
3M’s Electronics experts are ready to advise on any questions relating to semiconductors processing and handling and applications of 3M’s semiconductors manufacturing products.
