3M™ CMP Materials

CPU circuits on a large semiconductor wafer
Redefining CMP

3M™ CMP Materials help global semiconductor manufacturers deliver on process needs.


Chemical mechanical planarization solutions for semiconductor manufacturing

The rapid growth of new cloud computing, big data technology, 5G, Internet of Things, mobility and automation applications is driving rising demand for the latest semiconductor technology. To power these applications, advanced semiconductor manufacturing is consistently pushing the limits of what’s possible. New device architectures, novel materials and complex integration schemes call for increases in process intensity and complexity. Chemical mechanical planarization (CMP) plays a critical role in enabling these integrated processes for mature and advanced node technologies.

At 3M, we’re redefining CMP with innovative pads and pad conditioners. A trusted supplier with more than 25 years in the CMP market, we’re here to address a range of process needs including improved consistency, reduced variability, improved planarization performance, contamination and defectivity control, higher yield, and longer consumable lifetime.

  • What is chemical mechanical planarization (CMP)?

    Chemical mechanical planarization (or chemical mechanical polishing) is when semiconductor wafers undergo repeated polishing and planarization during fabrication to ensure that the wafer surface is flat and free of extraneous material before subsequent layer processing. This process uses a combination of a textured hard or soft CMP pad, a pad conditioner and a specialised slurry to polish the wafer.

    As the CMP pad is used over time, it must be regularly conditioned with a CMP pad conditioner to maintain consistent polishing performance. Pad conditioners can be made of hard or soft materials, and they can be designed with a range of sizes, textures and features to condition different types of pads. Integrated optimisation of pad, slurry and conditioner is increasingly necessary to deliver the required CMP performance at advanced nodes.

Help improve CMP process performance — and peace of mind

Maximise wafer output without sacrificing quality, consistency and yield

Whether you’re working on legacy nodes or the latest advanced nodes, 3M™ CMP Materials are ready to perform. We reach across more than 50 technology platforms to develop quality, consistent CMP disks driven by proprietary microreplication technology and expertise in surface modification, molding and adhesion. This dedication to consistency and customisation helps you gain more control over your CMP process and enjoy more cost-of-ownership benefits. Receive direct support from a dedicated team of technical experts, then enjoy local sampling and product iterations thanks to global laboratory and manufacturing capabilities.*

  • Icon of three identical wafers representing consistency in production
    • Quality materials
    • Reduced variation
    • Improved stability, predictability
  • Icon of a wafer next to a checklist representing customization
    • Tailored solutions
    • Tunable attributes
  • Icon of a wafer and a spyglass representing control
    • Less contamination risks
    • Reduced defectivity
    • Improved yield
  • Stable lifetime performance Extended lifespan  Reduced tool downtime
    Cost of ownership
    • Stable lifetime performance
    • Extended lifespan
    • Reduced tool downtime
  • *This information is based on tests performed at 3M laboratory facilities, and may be based on a limited sample size or a subset of 3M CMP materials. Many factors beyond 3M’s control and uniquely within the user’s control can affect the use and performance of 3M CMP materials in a particular semiconductor manufacturing application. To learn more about the specific properties and benefits of a given 3M CMP pad or 3M CMP pad conditioner, or to arrange a technical evaluation of the product, visit the 3M product catalog or contact 3M to speak with an expert.

Node-to-node CMP innovation

Innovation is at the core of who we are. From technology breakthroughs for CMP pads to optimized CMP pad conditioners, our history shows that the more we work together, the more we defy expectations.

Timeline of CMP innovation at 3M starting in 1998 - present
  • These advanced pads help you achieve consistent pad-to-pad performance, limit metal contamination risks and help you provide paradigm-shifting high planarization efficiency and low defect performance.

  • Explore 3M pad conditioning solutions, from 25 years of diamond pad technology and metal-free conditioner brushes to the latest precisely microreplicated patterns in 3M™ Trizact™ Pad Conditioners.

Ready to redefine your CMP process?

Our sales reps and technical teams are here to help.